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ABS and PC Material Integrated Circuit IC Chip Tray with Chemical Resistance

Nazwa marki:	Hiner-pack
Numer modelu:	HN25094
MOQ:	1000
Cena £:	TBC
Warunki płatności:	100% Prepayment
Zdolność do zaopatrzenia:	2000PCS/Day

Szczegółowe informacje

Opis produktu

Szczegółowe informacje

Miejsce pochodzenia:

Shenzhen, Chiny

Orzecznictwo:

ISO 9001 SGS ROHS

Kolor:

Czarny

Wytrzymały:

Tak

Pojemność:

12x17 = 204pcs

Warpage:

MAX 0,3 mm

Trwałość:

Odporny na uderzenia

Nieruchomość:

ESD, bez ESD

Rozmiar:

101,6*101,6*5,1 mm

Odporny na chemiczny:

Tak

Packaging Details:

500 Pcs/carton(According To Actual Packing）

Supply Ability:

2000PCS/Day

Podkreślić:

ABS PC IC chip tray

chemical resistant IC chip tray

integrated circuit chip tray

Opis produktu

Product Description:

IC Chip Tray is a crucial consumable widely adopted by semiconductor packaging and testing enterprises. Made primarily of plastic materials with antistatic and high-temperature resistant properties, it not only exhibits excellent physical and chemical performance but is also recyclable, meeting environmental protection requirements.

Our product offers significant antistatic protection, effectively preventing chips from damage caused by static electricity during transportation and storage. Its outstanding high-temperature resistance enables it to withstand high-temperature baking environments before chip packaging, ensuring material stability. Additionally, the tray's specific groove matrix design fixes chip positions, preventing pin bending or breaking, and providing physical protection for the chips.

Features:

Product Name: IC Chip Tray
Material: ABS, PC
Usage: Organizing And Storing IC Chips
Size: 101.6*101.6*5.1mm
Color: Black
Durability: Impact-resistant

Technical Parameters:

Durability	Impact-resistant
Property	ESD, Non-ESD
Color	Black
Warpage	Max 0.3mm
Usage	Organizing And Storing IC Chips
Size	101.6101.65.1mm
Material	ABS, PC
Capacity	12x17=204pcs
Durable	Yes
Chemical Resistant	Yes

Applications:

♣ ESD-safe containment for wafer-level chip transport in semiconductor fabs

♣ Precision positioning carrier in automated test equipment (ATE) systems

♣ Temporary storage solution for BGA/QFN packages in SMT production lines

FAQ:

Q:How about the after-sales guarantee of this product?

A:We guarantee to solve all quality problems of the product itself for you.

Q:Can the price be lower?

A:If the quantity of your order is large, we can give you an appropriate discount.

Q:Can we see the sample before placing the order?

A:We can provide samples for you.

Znaków:

Tace JEDEC IC

Tace JEDEC Matrix

Taca na chipy IC

Niestandardowe tace JEDEC

Tacki na chipsy w opakowaniu gofrów

Taca na komponenty elektroniczne

Tace z gołą matrycą

Tace antystatyczne

Klipsy do pokrywek waflowych

Żelowe lepkie pudełko

Pudełko do wysyłki opłatków

Kaseta z płytek metalowych

Tace JEDEC IC

Tace JEDEC Matrix

Taca na chipy IC

Niestandardowe tace JEDEC

Tacki na chipsy w opakowaniu gofrów

Taca na komponenty elektroniczne

Tace z gołą matrycą

Tace antystatyczne

Klipsy do pokrywek waflowych

Żelowe lepkie pudełko

Pudełko do wysyłki opłatków

Kaseta z płytek metalowych

ABS and PC Material Integrated Circuit IC Chip Tray with Chemical Resistance

ABS and PC Material Integrated Circuit IC Chip Tray with Chemical Resistance

ABS PC IC chip tray

chemical resistant IC chip tray

integrated circuit chip tray

Product Description:

Features:

Technical Parameters:

Applications:

FAQ: