produkty

Dom / produkty / Tace z gołą matrycą /

Cavity Size of 6.713.900.66 Black Bare Die Tray for Performance

Nazwa marki:	Hiner-pack
Numer modelu:	HN24045
MOQ:	1000 Pcs
Cena £:	$0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities）
Warunki płatności:	T/T
Zdolność do zaopatrzenia:	4000PCS~5000PCS/per Day

Szczegółowe informacje

Opis produktu

Szczegółowe informacje

Miejsce pochodzenia:

Shenzhen, Chiny

Orzecznictwo:

ROHS

Antytatyczne:

Tak

Używać:

Transport, magazyn, pakowanie

Płaskość:

<0,3 mm

Rozmiar:

dostosowane

Forma wtryskowa:

Czas realizacji 20 ~ 25 dni

Kolor:

Czarny

Kształt:

Prostokątny

Odporność na ciepło:

Tak

Packaging Details:

It Depends On The QTY Of Order And Size Of Product

Supply Ability:

4000PCS~5000PCS/per Day

Podkreślić:

black bare die tray

bare die tray 6.71x3.90 size

bare die tray with cavity

Opis produktu

Product Description:

Our Bare Die Trays can provide a secure and organized way to handle delicate bare die components during production, assembly, testing, and shipping.They are designed in a rectangular shape to efficiently accommodate multiple bare die chips. Their customized size ensures a perfect fit for various die sizes, offering flexibility and versatility in handling different types of components. These trays come in a sleek black color, giving them a professional and modern look suitable for industrial environments.

Technical Parameters:

Durability	Sturdy And Impact-Resistant
Color	Black
Injection Mold	Lead Time 20~25 Days
Capacity	Holds Multiple Bare Die Chips
Customizable Logo	Yes
Flatness	<0.3mm
Shape	Rectangular
Size	Customized
Anti-Static	Yes
Surface Resistance	1.0x10E4~1.0x10E11Ω

Applications:

I.Chip On Board (COB) Assembly

Bare Die Trays provide secure positioning and electrostatic discharge (ESD) protection for singulated semiconductor dice during manual or automated COB assembly processes.

II.Flip Chip and 3D Packaging

The trays' precision-engineered pockets accommodate backside-exposed dice required for flip chip bonding, enabling accurate alignment during flux application and reflow processes.

Support and Services:

♠Customized Packaging Solutions: We offer tailored Bare Die Trays designed to meet the specific requirements of your die sizes and configurations, ensuring optimal protection and handling during transportation and storage.

♠On-site Technical Support: Our team of experts provides on-site assistance for the installation, integration, and troubleshooting of Bare Die Trays, ensuring seamless operations and minimizing downtime.

FAQ:

Q:How long can the production be put into production after the order is placed?

A:Generally, it takes one or two working days.

Q: What is the minimum order quantity for the Bare Die Trays?
A: The minimum order quantity for the Bare Die Trays is 1000 pieces.

Znaków:

Tace JEDEC IC

Tace JEDEC Matrix

Taca na chipy IC

Niestandardowe tace JEDEC

Tacki na chipsy w opakowaniu gofrów

Taca na komponenty elektroniczne

Tace z gołą matrycą

Tace antystatyczne

Klipsy do pokrywek waflowych

Żelowe lepkie pudełko

Pudełko do wysyłki opłatków

Kaseta z płytek metalowych

Tace JEDEC IC

Tace JEDEC Matrix

Taca na chipy IC

Niestandardowe tace JEDEC

Tacki na chipsy w opakowaniu gofrów

Taca na komponenty elektroniczne

Tace z gołą matrycą

Tace antystatyczne

Klipsy do pokrywek waflowych

Żelowe lepkie pudełko

Pudełko do wysyłki opłatków

Kaseta z płytek metalowych

Cavity Size of 6.71*3.90*0.66 Black Bare Die Tray for Performance

Cavity Size of 6.71*3.90*0.66 Black Bare Die Tray for Performance

black bare die tray

bare die tray 6.71x3.90 size

bare die tray with cavity

Product Description:

Technical Parameters:

Applications:

Support and Services:

FAQ:

Cavity Size of 6.713.900.66 Black Bare Die Tray for Performance

Cavity Size of 6.713.900.66 Black Bare Die Tray for Performance