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Bare Die Tray with a Capacity of 11x13=143PCS Suitable for the Semiconductor Industry

Name: Bare Die Tray with a Capacity of 11x13=143PCS Suitable for the Semiconductor Industry
Brand: Shenzhen Hiner Technology Co.,LTD
SKU: HN25064
Price: 0.35 USD
Availability: InStock

Nazwa marki:	Hiner-pack
Numer modelu:	HN25064
MOQ:	1000 Pcs
Cena £:	$0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities）
Warunki płatności:	T/T
Zdolność do zaopatrzenia:	4000PCS~5000PCS/per Day

Szczegółowe informacje

Opis produktu

Szczegółowe informacje

Miejsce pochodzenia:

Shenzhen, Chiny

Orzecznictwo:

ISO 9001 ROHS SGS

Fakultatywny:

Pokrywka/pokrywa i klip/zacisk

Metoda formowania:

Formowanie wtryskowe

Nieruchomość:

ESD, bez ESD

Warpage:

＜ 0,3 mm

Kształt:

Prostokątny

Niestandardowe logo:

Dostępny

Odporność na ciepło:

Tak

Packaging Details:

It Depends On The QTY Of Order And Size Of Product

Supply Ability:

4000PCS~5000PCS/per Day

Podkreślić:

Bare Die Tray 11x13 capacity

Semiconductor industry die tray

143PCS bare die storage

Opis produktu

Product Description:

As a leading provider in the semiconductor packaging and testing industry, our firm has innovatively crafted the Die Carrier Series, tailored to fulfill the exacting demands of advanced semiconductor manufacturing. Aligning with the worldwide Semiconductor industry towards miniaturization and heightened integration, we have thoroughly comprehended the rigorous market specifications for chip packaging solutions, resulting in a comprehensive portfolio encompassing chips of all sizes. This offering boasts permanent antistatic properties, dust resistance, and robust durability, alongside unparalleled dimensional precision.

Features:

Product Name: Bare Die Trays
Customizable Logo: Available
Molding Method: Injection Moulding
Heat Resistant: Yes
Stackable: Yes
Esd Protection: Yes

Applications:

♦Temporary Storage in Semiconductor Production:

During the manufacturing and packaging of semiconductor chips, it can effectively protect the chips from physical damage and electrostatic discharge, ensuring the integrity and reliability of the chips throughout the manufacturing and packaging process.

♦Chip Transportation and Distribution:

As a professional packaging container, the bare die tray can effectively protect the chips during transportation, reducing the risk of chip failure due to physical damage or electrostatic discharge.

Customization:

Brand Name: Hiner-pack

Model Number: HN25064

Place Of Origin: Shenzhen, China

Packaging Details: It Depends On The QTY Of Order And Size Of Product

Molding Method: Injection Moulding

Heat Resistant: Yes

Outline Line Size	101.6101.66mm	Brand	Hiner-pack
Model	HN 25064	Package Type	FBGA IC
Cavity Size	5.74.22.25mm	Matrix QTY	11*13=142PCS
Material	ABS,PC	Flatness	MAX 0.3mm
Color	Black	Service	Accept OEM,ODM
Resistance	1.0x10e4-1.0x10e11Ω	Certificate	ROHS

Packing and Shipping:

♠Product Packaging:

The Bare Die Trays are carefully placed in individual compartments within a sturdy cardboard box to ensure safe transportation.

♠Shipping:

Once packed, the Bare Die Trays are sealed and labeled for shipping. They are then securely placed in a shipping box along with any necessary packing materials to prevent damage during transit.

Znaków:

Tace JEDEC IC

Tace JEDEC Matrix

Taca na chipy IC

Niestandardowe tace JEDEC

Tacki na chipsy w opakowaniu gofrów

Taca na komponenty elektroniczne

Tace z gołą matrycą

Tace antystatyczne

Klipsy do pokrywek waflowych

Żelowe lepkie pudełko

Pudełko do wysyłki opłatków

Kaseta z płytek metalowych

Tace JEDEC IC

Tace JEDEC Matrix

Taca na chipy IC

Niestandardowe tace JEDEC

Tacki na chipsy w opakowaniu gofrów

Taca na komponenty elektroniczne

Tace z gołą matrycą

Tace antystatyczne

Klipsy do pokrywek waflowych

Żelowe lepkie pudełko

Pudełko do wysyłki opłatków

Kaseta z płytek metalowych

Bare Die Tray with a Capacity of 11x13=143PCS Suitable for the Semiconductor Industry

Bare Die Tray with a Capacity of 11x13=143PCS Suitable for the Semiconductor Industry

Bare Die Tray 11x13 capacity

Semiconductor industry die tray

143PCS bare die storage

Product Description:

Features:

Applications:

Customization:

Packing and Shipping:

Tace z gołą matrycą ODM

tace z gołą matrycą CSP

tace z pakietami w skali chipów CSP

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ODM Anti Static Bare Die Tray CSP Chip Scale Package Transport IC